Announcements And Insights
Why We Invested in NovoLINC to Revolutionize Thermal Interface Solutions for Next-Generation AI Chip Cooling
Introduction In summer 2024, TDK Ventures discussed that 40% of energy consumption in data centers comes from cooling power-hungry advanced computing chips [1]. The trends we highlighted continue to persist. The energy consumption of US data centers alone is expected to increase as much as 10% in the next few years and more than double […]
TDK Ventures Invests in NovoLINC’s Advanced Thermal Interface Solutions for Next Generation AI Computing
NovoLINC’s unique approach incorporates a proprietary materials system and nanomechanical design, delivering significantly lower thermal resistance compared to conventional materials.
Supporting Team
Related Next-Gen Materials Startups
SLD Laser is using highly efficient blue lasers embedded onto a chip with high performance phosphorus, they have created a laser light source with 100x greater luminance than LEDs, 10x the contrast, 10x the distance, and 1/10th the beam angle.
Metalenz brings state of the art upgrades to optics across the board (agility, versatility, and resolution) with improved performance at lower manufacturing cost.
actnano is setting a new standard for electronics protection with its commercialized water and environmental- resistant nanocoating technology, Advanced nanoGuard™ (ANG).
microLED innovator VueReal Inc. brings unprecedented throughput, precision, and yield to the multi-billion-dollar microLED industry with its revolutionary “microprinting” mass transfer approach VueReal’s methodology addresses